CENTRE FOR INDUSTRIAL AND GOVERNMENTAL COLLABORATION (CIGC) CIGC Universiti Malaysia Perlis

Exclusive-TSMC considering advanced chip packaging capacity in Japan, sources say

https://www.thestar.com.my/tech/tech-news/2024/03/18/exclusive-tsmc-considering-advanced-chip-packaging-capacity-in-japan-sources-say

Centre for Industrial & Governmental Collaboration (CIGC)
Universiti Malaysia Perlis (UniMAP)
2nd Floor, Administration Block,
Engineering Training Centre,
Pauh Putra UniMAP Alam Campus,
02600 Arau, Perlis

Tel : +04-941 4384 / 4395
Email : cigc@unimap.edu.my

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